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TIA Appoints David Bain, New Vice President of Standards

By Ken Briodagh November 14, 2018

The Telecommunications Industry Association (TIA), the association representing the manufacturers and suppliers of high-tech communications networks, recently announced that David K. Bain has been named Vice President of Standards, leading the team executing one of the core responsibilities of TIA as an ANSI-accredited Standards Developing Organization (SDO).

“David has previously served on TIA's TR-34 Satellite Engineering Standards Committee and we’re excited to expand his leadership over our critical standards work,” said Wes Johnston, CEO, TIA. “David's exceptional knowledge across the breadth of many ICT technologies and experience in global standards and entrepreneurship will help TIA be a catalyst for innovation and new engagement in the standards domain.”

David Bain joins TIA from the Technology Safety Council, promoting safety and sustainability best practices to technology users, suppliers, and regulators.  Prior to his time at the Technology Safety Council, he spent seven years with TM Technologies, a pioneer in ultra-efficient, ultra-secure forms of wireless modulation, where he served as CEO and Director of Industry and Government Affairs. In addition, his experience as a presenter, university lecturer and panelist on Capitol Hill brings a superior level of messaging to TIA’s senior leadership team.

“After working closely with TIA as a member of the TR-34 Satellite Engineering Standards Committee, I am proud to join this team of talented and experienced industry leaders as we work to develop standards in a 5G future,” said Bain.

TIA’s standards work is conducted by the volunteer members of TIA engineering committees. Recent meeting reports, agendas and notices for upcoming meetings, as well as links to some of the most popular standards from each committee are available on the public engineering committee pages. TIA is accredited by the American National Standards Institute (ANSI).


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Edited by Ken Briodagh
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